Speakers

Dr. Muhannad Bakir

Dr. Muhannad Bakir

Professor / Georgia Tech | Technical Leadership Panel

Dr. Muhannad Bakir

Muhannad S. Bakir is the Dan Fielder Professor in the School of Electrical and Computer Engineering at Georgia Tech. His areas of interest include 2.5D and 3D heterogeneous integration technologies, photonic interconnect networks and co-packaging, embedded cooling and power delivery for emerging heterogeneous integration architectures, and flexible electronics for healthcare. Dr. Bakir and his research group have received more than thirty paper and presentation awards including six from the IEEE Electronic Components and Technology Conference (ECTC), four from the IEEE International Interconnect Technology Conference (IITC), and one (best invited paper) from the IEEE Custom Integrated Circuits Conference (CICC). Dr. Bakir's group was awarded Best Paper Awards from the 2014 and 2017 IEEE Transactions on Components Packaging and Manufacturing Technology (TCPMT). Dr. Bakir is the recipient of the 2013 Intel Early Career Faculty Honor Award, 2012 DARPA Young Faculty Award, 2011 IEEE CPMT Society Outstanding Young Engineer Award, and was an Invited Participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium. Dr. Bakir is also the recipient of the 2018 IEEE Electronics Packaging Society (EPS) Exceptional Technical Achievement Award "for contributions to 2.5D and 3D IC heterogeneous integration, with focus on interconnect technologies." He is also the co-recipient of the 2018 McKnight Foundation Technological Innovations in Neuroscience Awards.

In 2020, Dr. Bakir was the recipient of the Georgia Tech Outstanding Doctoral Thesis Advisor Award. He is also the recipient of several teaching awards, including the 2014 and 2015 Georgia Institute of Technology Class of 1940 Course Survey Teaching Effectiveness Award, and the 2020 Student Recognition of Excellence in Teaching: Class of 1934 Award.

Dr. Bakir serves as a senior area editor of IEEE Transactions on Components, Packaging and Manufacturing Technology (TCPMT) and was an Editor of IEEE Transactions on Electron Devices (TED) from 2014-2020.

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