Wednesday, August 19, 2020
MTO 101 and MTO Symposium Panel
2:15 - 5:25 PM
Dr. Mark Rosker, DARPA
Dr. Dev Palmer, DARPA
Select MTO Program Managers
Agenda | Slides
During MTO 101, Office leadership will provide information on the Microsystems Technology Office (MTO) and its ongoing and desired research priorities. The session - which will be repeated on Thursday August 20 - will also include valuable information on how best to engage with MTO and to seek research funding. The MTO 101 session will be immediately followed by a live, interactive panel featuring MTO Leadership and several MTO program managers (PMs). The PMs will share current and potential research areas from outside of the ERI portfolio, with topics that may include management of the radiofrequency spectrum and positioning, navigation, and timing. DARPA Leadership and PMs will conclude the session by taking questions from participants.
2:15 - 5:25 PM
Dr. Mark Rosker, DARPA
Dr. Dev Palmer, DARPA
Select MTO Program Managers
Agenda | Slides
During MTO 101, Office leadership will provide information on the Microsystems Technology Office (MTO) and its ongoing and desired research priorities. The session - which will be repeated on Thursday August 20 - will also include valuable information on how best to engage with MTO and to seek research funding. The MTO 101 session will be immediately followed by a live, interactive panel featuring MTO Leadership and several MTO program managers (PMs). The PMs will share current and potential research areas from outside of the ERI portfolio, with topics that may include management of the radiofrequency spectrum and positioning, navigation, and timing. DARPA Leadership and PMs will conclude the session by taking questions from participants.
Heterogeneous 3D Microsystems - Increased Functional Density for Next Generation RF Sensors
2:15 - 5:45 PM
Dr. Tom Kazior, DARPA
Agenda and Slides
To continue performing diverse missions in increasingly crowded electromagnetic (EM) environments, future sensor and communication systems will require increased bandwidth and sensitivity as well as enhanced functionality per unit area. These needs are driving sensor arrays toward 3D solutions, particularly at millimeter wave and THz frequencies. This workshop builds on last year's Heterogeneous Integration (HI) workshop and focuses on the 3D stacking of RF, analog/mixed signal, and digital functions. The workshop features speakers from government, academia, commercial industry, and the defense industrial base. The workshop concludes with a discussion on the unique 3DHI challenges for RF/mixed signal applications and suggestions for potential paths forward.
2:15 - 5:45 PM
Dr. Tom Kazior, DARPA
Agenda and Slides
To continue performing diverse missions in increasingly crowded electromagnetic (EM) environments, future sensor and communication systems will require increased bandwidth and sensitivity as well as enhanced functionality per unit area. These needs are driving sensor arrays toward 3D solutions, particularly at millimeter wave and THz frequencies. This workshop builds on last year's Heterogeneous Integration (HI) workshop and focuses on the 3D stacking of RF, analog/mixed signal, and digital functions. The workshop features speakers from government, academia, commercial industry, and the defense industrial base. The workshop concludes with a discussion on the unique 3DHI challenges for RF/mixed signal applications and suggestions for potential paths forward.
Heterogeneous 3D Microsystems - Opportunities for Photonics: Emerging Computing Concepts and Architectures
2:15 - 5:45 PM
Dr. Gordon Keeler, DARPA
Agenda
This workshop will explore both short- and long-term insertion opportunities for integrated photonics technologies in computing systems that leverage innovation under the DARPA Photonics in the Package for Extreme Scalability (PIPES) and Lasers for Universal Microscale Optical Systems (LUMOS) programs. The PIPES program is realizing co-packaged optical interconnect technologies with low energy and latency. The workshop begins by considering new transition opportunities in existing and emerging computing architectures (HPC, AI/ML, data center) for PIPES technologies. The LUMOS program seeks to enhance silicon photonics by incorporating on-chip gain and non-linearities in an accessible, flexible advanced foundry process. Such technologies are likely to enable new photonics applications for information processing systems. The workshop considers the possibilities for the LUMOS technologies for advanced electronic/photonic platforms, neuromorphic optical computing, and quantum information systems.
2:15 - 5:45 PM
Dr. Gordon Keeler, DARPA
Agenda
This workshop will explore both short- and long-term insertion opportunities for integrated photonics technologies in computing systems that leverage innovation under the DARPA Photonics in the Package for Extreme Scalability (PIPES) and Lasers for Universal Microscale Optical Systems (LUMOS) programs. The PIPES program is realizing co-packaged optical interconnect technologies with low energy and latency. The workshop begins by considering new transition opportunities in existing and emerging computing architectures (HPC, AI/ML, data center) for PIPES technologies. The LUMOS program seeks to enhance silicon photonics by incorporating on-chip gain and non-linearities in an accessible, flexible advanced foundry process. Such technologies are likely to enable new photonics applications for information processing systems. The workshop considers the possibilities for the LUMOS technologies for advanced electronic/photonic platforms, neuromorphic optical computing, and quantum information systems.
Autonomy and Processing - Technologies and Non-Volatile Memory for Multifunctional Memory and Computing
2:15 - 5:45 PM
Dr. Ron Polcawich, DARPA
Dr. Y.K. Chen, DARPA
Dr. Ali Keshavarzi, Stanford University
Agenda
The workshop gathers thought leaders to discuss current state-of-the-art and the industrial roadmaps to probe into promising new technology approaches for the next-generation of multifunctional memory. A range of speakers will identify possible unique Department of Defense (DoD) applications enabled by technologies and device structures to take advantage of dense low write-energy and multi-bit non-volatile memory (NVM) capabilities for next-generation memory-enhanced data-centric computing.
2:15 - 5:45 PM
Dr. Ron Polcawich, DARPA
Dr. Y.K. Chen, DARPA
Dr. Ali Keshavarzi, Stanford University
Agenda
The workshop gathers thought leaders to discuss current state-of-the-art and the industrial roadmaps to probe into promising new technology approaches for the next-generation of multifunctional memory. A range of speakers will identify possible unique Department of Defense (DoD) applications enabled by technologies and device structures to take advantage of dense low write-energy and multi-bit non-volatile memory (NVM) capabilities for next-generation memory-enhanced data-centric computing.
Competitive Ecosystem - Creating a Resilient and Robust Microelectronics Pipeline
2:15 - 5:45 PM
Dr. Matt Casto, Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E))
Agenda | Slide Set 1 | Slide Set 2
This workshop reviews the actions underway by the Department of Defense (DoD) to encourage the adoption of disruptive technologies, foster alliances within the microelectronics ecosystem, strengthen the workforce, and maintain U.S. leadership as the global source for advanced, secure, and reliable microelectronics. The program manager for the Trusted and Assured Microelectronics program will lead a panel of subject matter experts in describing the Department's strategy for promoting innovation and creating a resilient and robust microelectronics pipeline, including supply chain, next generation technology, and workforce. The intent is to slow -- and in the long-term reverse -- off-shoring trends by fostering commercial and Government opportunities and alliances that preserve the ecosystem and support the Department's microelectronics strategy.
2:15 - 5:45 PM
Dr. Matt Casto, Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E))
Agenda | Slide Set 1 | Slide Set 2
This workshop reviews the actions underway by the Department of Defense (DoD) to encourage the adoption of disruptive technologies, foster alliances within the microelectronics ecosystem, strengthen the workforce, and maintain U.S. leadership as the global source for advanced, secure, and reliable microelectronics. The program manager for the Trusted and Assured Microelectronics program will lead a panel of subject matter experts in describing the Department's strategy for promoting innovation and creating a resilient and robust microelectronics pipeline, including supply chain, next generation technology, and workforce. The intent is to slow -- and in the long-term reverse -- off-shoring trends by fostering commercial and Government opportunities and alliances that preserve the ecosystem and support the Department's microelectronics strategy.
Security and Access - Access to State of the Art Microelectronics with Quantifiable Assurance
2:15 - 5:45 PM
Dr. Morgan Thoma, Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E))
Dr. Brian Dupaix, Air Force Research Lab (AFRL)
Agenda | Slide Set 1 | Slide Set 2
The Department of Defense (DoD) is committed to the secure development and demonstration of new microelectronics technology solutions. This workshop will review two major DoD thrusts: 1) Access to State of the Art Commercial Technology and 2) Data-Driven Quantifiable Assurance. These initiatives are leveraging strategic partnerships with commercial domestic providers to perfect a data-driven, "zero-trust" risk-based approach for supply chain protection and assured access to advanced microelectronics technology and electronic components. The workshop will examine new assurance paradigms and standards for supply chain protection and methods for strengthening security while improving access to and protection of sensitive intellectual property (IP). Quantifiable assured design concepts will be discussed along with risk-based protection techniques that meet or exceed National Security Agency standards for IP protection. The goal of these thrust areas is to keep pace with the advancements in microelectronics technology and the globalization of the industrial sector.
2:15 - 5:45 PM
Dr. Morgan Thoma, Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E))
Dr. Brian Dupaix, Air Force Research Lab (AFRL)
Agenda | Slide Set 1 | Slide Set 2
The Department of Defense (DoD) is committed to the secure development and demonstration of new microelectronics technology solutions. This workshop will review two major DoD thrusts: 1) Access to State of the Art Commercial Technology and 2) Data-Driven Quantifiable Assurance. These initiatives are leveraging strategic partnerships with commercial domestic providers to perfect a data-driven, "zero-trust" risk-based approach for supply chain protection and assured access to advanced microelectronics technology and electronic components. The workshop will examine new assurance paradigms and standards for supply chain protection and methods for strengthening security while improving access to and protection of sensitive intellectual property (IP). Quantifiable assured design concepts will be discussed along with risk-based protection techniques that meet or exceed National Security Agency standards for IP protection. The goal of these thrust areas is to keep pace with the advancements in microelectronics technology and the globalization of the industrial sector.
Thursday, August 20, 2020
MTO 101 and ERI Panel
2:15 - 4:45 PM
Dr. Mark Rosker, DARPA
Dr. Dev Palmer, DARPA
Select ERI Program Managers
Agenda | Slides
During MTO 101, Office leadership will provide information on the Microsystems Technology Office (MTO) and its ongoing and desired research priorities. The session - which repeats content from Wednesday August 19 - will also include valuable information on how best to engage with MTO and to seek research funding. The MTO 101 session will be immediately followed by a live, interactive panel featuring MTO Leadership and several MTO program managers (PMs). The PMs will specifically discuss work within the ERI portfolio, concluding the session by taking questions from participants.
2:15 - 4:45 PM
Dr. Mark Rosker, DARPA
Dr. Dev Palmer, DARPA
Select ERI Program Managers
Agenda | Slides
During MTO 101, Office leadership will provide information on the Microsystems Technology Office (MTO) and its ongoing and desired research priorities. The session - which repeats content from Wednesday August 19 - will also include valuable information on how best to engage with MTO and to seek research funding. The MTO 101 session will be immediately followed by a live, interactive panel featuring MTO Leadership and several MTO program managers (PMs). The PMs will specifically discuss work within the ERI portfolio, concluding the session by taking questions from participants.
Security and Access - Heterogeneous 3D Microsystems - Reinventing Moore's Law through Desktop Manufacturing
2:15 - 5:45 PM
Dr. Tim Hancock, DARPA
Dr. Ron Polcawich, DARPA
Agenda | Slides
Moore's Law is defined by smaller transistors on bigger wafers to reduce the cost per transistor with the assumption that non-recurring cost is completely amortized away over the lifetime of a product. While the DoD has enjoyed the performance enhancement that smaller transistors have brought, the defense applications and other small volume, niche applications do not fit within these boundary conditions and would benefit from a different cost model where recurring cost was higher and production volumes much lower. This workshop will explore desktop manufacturing techniques that could apply device scaling in small volumes and to a broader set of devices than just digital CMOS. The workshop will begin by introducing and defining the problem, followed by several invited speakers from the field. The session will conclude with a program manager-led panel to brainstorm next steps and areas for potential investment.
2:15 - 5:45 PM
Dr. Tim Hancock, DARPA
Dr. Ron Polcawich, DARPA
Agenda | Slides
Moore's Law is defined by smaller transistors on bigger wafers to reduce the cost per transistor with the assumption that non-recurring cost is completely amortized away over the lifetime of a product. While the DoD has enjoyed the performance enhancement that smaller transistors have brought, the defense applications and other small volume, niche applications do not fit within these boundary conditions and would benefit from a different cost model where recurring cost was higher and production volumes much lower. This workshop will explore desktop manufacturing techniques that could apply device scaling in small volumes and to a broader set of devices than just digital CMOS. The workshop will begin by introducing and defining the problem, followed by several invited speakers from the field. The session will conclude with a program manager-led panel to brainstorm next steps and areas for potential investment.
Cybersecurity - Simplifying the Development of Provably Secure Multilevel Security Architectures
2:15 - 5:45 PM
Mr. Walter Weiss, DARPA
Agenda | Slides
This interactive workshop introduces novel language extensions and software co-design tools developed under the DARPA Guaranteed Architecture for Physical Security (GAPS) program to revolutionize the development of cross-domain systems that are correct-by-construction with provable security guarantees. Attendees of this workshop will use GAPS development and emulation tools to express cross-domain security constraints within example applications and evaluate the results on an emulator modelling multiple security enclaves. Attendees will also learn about novel GAPS hardware in progress for further enforcing guards on the cross-domain boundary.
2:15 - 5:45 PM
Mr. Walter Weiss, DARPA
Agenda | Slides
This interactive workshop introduces novel language extensions and software co-design tools developed under the DARPA Guaranteed Architecture for Physical Security (GAPS) program to revolutionize the development of cross-domain systems that are correct-by-construction with provable security guarantees. Attendees of this workshop will use GAPS development and emulation tools to express cross-domain security constraints within example applications and evaluate the results on an emulator modelling multiple security enclaves. Attendees will also learn about novel GAPS hardware in progress for further enforcing guards on the cross-domain boundary.
Competitive Ecosystem - Joint University Microelectronics Program (JUMP)
2:15 - 5:45 PM
Dr. Todd Younkin, Semiconductor Research Corporation (SRC)
Agenda | Slides
The JUMP program co-funds U.S. universities with 12 major semiconductor, computing, and aerospace companies to undertake high-risk, high-payoff research that addresses existing and emerging challenges in microelectronic technologies. This JUMP program workshop aims to provide an overview of the six research centers under the JUMP program and selected technical highlights.
2:15 - 5:45 PM
Dr. Todd Younkin, Semiconductor Research Corporation (SRC)
Agenda | Slides
The JUMP program co-funds U.S. universities with 12 major semiconductor, computing, and aerospace companies to undertake high-risk, high-payoff research that addresses existing and emerging challenges in microelectronic technologies. This JUMP program workshop aims to provide an overview of the six research centers under the JUMP program and selected technical highlights.
Security and Access - Addressing DoD Unique Microelectronic Needs
2:15 - 3:45 PM
Dr. Matt Kay, Naval Surface Warfare Center (NSWC) Crane
Agenda | Slides
This workshop will investigate the priorities and progress of the Department of Defense (DoD) to address its unique microelectronics needs. In particular, the workshop will address the development of sustainable sources of niche DoD technologies, including mission essential radiation-hardened electronics capabilities and specialized radiofrequency and electro-optic components. The Department is partnering with the intelligence community, the Department of Energy, the National Aeronautics and Space Administration (NASA), and others to develop radiation hardened components that permit systems to operate in space and other harsh environments. A similar situation exists for advancing radio frequency and optical applications, where innovative approaches are being developed to address unique requirements and specifications, and promote future incentives for co-investment with industry.
2:15 - 3:45 PM
Dr. Matt Kay, Naval Surface Warfare Center (NSWC) Crane
Agenda | Slides
This workshop will investigate the priorities and progress of the Department of Defense (DoD) to address its unique microelectronics needs. In particular, the workshop will address the development of sustainable sources of niche DoD technologies, including mission essential radiation-hardened electronics capabilities and specialized radiofrequency and electro-optic components. The Department is partnering with the intelligence community, the Department of Energy, the National Aeronautics and Space Administration (NASA), and others to develop radiation hardened components that permit systems to operate in space and other harsh environments. A similar situation exists for advancing radio frequency and optical applications, where innovative approaches are being developed to address unique requirements and specifications, and promote future incentives for co-investment with industry.
Competitive Ecosystem - State of the Global Semiconductor Industry
4:00 - 5:45 PM
Mr. Travis Mosier, U.S. Department of Commerce, Office of Health and Information Technologies
Agenda and Slides
The global semiconductor industry is experiencing the biggest seismic shift since Gordon Moore predicted the technology's innovation trajectory over 55 years ago. Microchip content across the electronics ecosystem is set to explode as existing and emerging applications create unprecedented opportunities for the industry. However, potential threats are quickly changing the traditional industry growth paradigm and forcing companies to adapt. This session will explore current market conditions, the state of U.S. industry competitiveness, impacts of the coronavirus, China's semiconductor industry development, and other factors affecting the global semiconductor industry.
4:00 - 5:45 PM
Mr. Travis Mosier, U.S. Department of Commerce, Office of Health and Information Technologies
Agenda and Slides
The global semiconductor industry is experiencing the biggest seismic shift since Gordon Moore predicted the technology's innovation trajectory over 55 years ago. Microchip content across the electronics ecosystem is set to explode as existing and emerging applications create unprecedented opportunities for the industry. However, potential threats are quickly changing the traditional industry growth paradigm and forcing companies to adapt. This session will explore current market conditions, the state of U.S. industry competitiveness, impacts of the coronavirus, China's semiconductor industry development, and other factors affecting the global semiconductor industry.
Competitive Ecosystem - Microelectronics Research and Capabilities across the DOE Laboratory Complex
4:00 - 5:45 PM
Dr. Andrew Schwartz, Department of Energy Office of Science
Agenda | Slides
This workshop will be designed as a broad survey intended to educate ERI researchers about the diverse expertise and capabilities available at the DOE National Labs. Information will be provided about open access scientific user facilities; active research programs in advanced microelectronics; and state-of-the-art synthesis, fabrication, characterization, and modeling tools. As appropriate, guidance will be presented for attendees to access DOE Lab capabilities or explore the possibilities of collaborative research on topics of mutual interest.
4:00 - 5:45 PM
Dr. Andrew Schwartz, Department of Energy Office of Science
Agenda | Slides
This workshop will be designed as a broad survey intended to educate ERI researchers about the diverse expertise and capabilities available at the DOE National Labs. Information will be provided about open access scientific user facilities; active research programs in advanced microelectronics; and state-of-the-art synthesis, fabrication, characterization, and modeling tools. As appropriate, guidance will be presented for attendees to access DOE Lab capabilities or explore the possibilities of collaborative research on topics of mutual interest.
Competitive Ecosystem - Access to Advanced Packaging and Test
4:00 - 5:45 PM
Mr. Brett Hamilton, Naval Surface Warfare Center (NSWC) Crane
Agenda | Slides
The Navy State of the art (SOTA) Heterogeneous Integration Prototype (SHIP) program that the Naval Surface Weapon Center at Crane leads is an initiative to deliver an on-shore advanced packaging assembly and test capability. This capability will enable a revolutionary leap in system performance and greatly reduce system size, weight, and power by incorporating the immense advances in SOTA commercial-off-the-shelf (COTS) processing technologies, such as field programmable gate arrays, microprocessors, and graphic processing units. The workshop will review ongoing SHIP activities to enhance the secure design and packaging capability with new tools/techniques, qualify advanced heterogeneous packaging technology, and develop a secure, accessible, and cost effective SOTA heterogeneous integration design, assembly, and test capability. These SHIP activities leverage the expertise of commercial industry to develop and demonstrate a novel approach towards secure, heterogeneous integration, assembly, and test of advanced packaging.
4:00 - 5:45 PM
Mr. Brett Hamilton, Naval Surface Warfare Center (NSWC) Crane
Agenda | Slides
The Navy State of the art (SOTA) Heterogeneous Integration Prototype (SHIP) program that the Naval Surface Weapon Center at Crane leads is an initiative to deliver an on-shore advanced packaging assembly and test capability. This capability will enable a revolutionary leap in system performance and greatly reduce system size, weight, and power by incorporating the immense advances in SOTA commercial-off-the-shelf (COTS) processing technologies, such as field programmable gate arrays, microprocessors, and graphic processing units. The workshop will review ongoing SHIP activities to enhance the secure design and packaging capability with new tools/techniques, qualify advanced heterogeneous packaging technology, and develop a secure, accessible, and cost effective SOTA heterogeneous integration design, assembly, and test capability. These SHIP activities leverage the expertise of commercial industry to develop and demonstrate a novel approach towards secure, heterogeneous integration, assembly, and test of advanced packaging.