Dr. Vincent (WooPoung) Kim

Dr. Vincent (WooPoung) Kim

Corporate Executive Vice President and Head of Packaging Solution Center / Samsung Electronics US

Dr. Vincent (WooPoung) Kim

Dr. KIM is currently working as Corporate EVP / Head of DSRA-AVP in San Jose, CA. SAMSUNG has launched a new business unit for supporting the need of the semiconductor industry's advanced packaging to build higher-performance systems. The name of the new business is AVP (Advanced Packaging). Prior to joining Samsung, he was a system architect for Signal Integrity and Power Integrity at Apple, path-finding to build leading-edge consumer computers. Before Apple, he was with Qualcomm as SI manager in Snapdragon packaging. Prior to joining Qualcomm, he was a co-design engineer at Wireless Business Unit of Texas Instruments working to optimize the electrical design of OMAP packages/systems. Before TI, he was with Rambus as SI engineer to design and analyze memory systems. Dr. Kim received Ph.D Degree in ECE at Georgia Tech in 2004 and M.S. & B.A. degrees from KAIST, Korea in 1999 and 1997.

Presentation Date/Time:
Tuesday, August 22, 2023

3D IC EDA: What is Needed, and How/When Can We Deliver?
(1:40pm - 1:50pm)

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