Mr. Timothy Lee

Mr. Timothy Lee

Technical Fellow / Boeing

Mr. Timothy Lee

Timothy Lee, a Boeing Technical Fellow based in Southern CA, leads the development of disruptive microelectronics technologies for advanced communications networks and sensor systems for airborne and space applications. His current research interests include silicon Application Specific Integrated Circuits (ASICs) and gallium nitride Monolithic Microwave Integrated Circuits (MMICs), and 3DIC technologies for vertical integration of digital Si chiplets and analog/RF devices. He led the development of hardware for satellite communications and has built phased-array antenna electronics for commercial and US government customers. Lee hold SMEE and SBEE degrees from MIT and a Master's degree on System Engineering from USC. He is an active vulunterer in the IEEE. He is a past member of the IEEE Board of Directors (2021-2022) and past President of the IEEE Microwave Theory and Technology Society (MTT-S). He leads several Technical Working Groups in the IEEE Heterogenous Integration Roadmap (HIR) and in the IEEE Future Networks Technical Community.

Presentation Date/Time:
Tuesday, August 22, 2023

3D IC EDA: What Is Needed, and How/When Can We Deliver?
(1:25pm - 1:40pm)

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